From 293f406cac5d825a0f31a59c76d476c553c93db6 Mon Sep 17 00:00:00 2001
From: ShadowViper1 <44275545+ShadowViper1@users.noreply.github.com>
Date: Mon, 5 Nov 2018 08:58:41 -0500
Subject: [PATCH] Update index.md (#21083)

---
 guide/english/computer-hardware/cooling/index.md | 11 +++++++++++
 1 file changed, 11 insertions(+)

diff --git a/guide/english/computer-hardware/cooling/index.md b/guide/english/computer-hardware/cooling/index.md
index 3261af7435..0b471b02e9 100644
--- a/guide/english/computer-hardware/cooling/index.md
+++ b/guide/english/computer-hardware/cooling/index.md
@@ -22,4 +22,15 @@ Room ventilation - Place the computer in a neutral location away from the rooms
 * Placement next to other computers - Locating the computer away from other equipment allows air to flow in and out of the computer. Placement close to other equipment can constrict air flow and increase heat.
 * Cable Management = Having a rat's nest of cables can block air flow and make your computer hotter. It is reccomended to take some time to cable manage after building a computer, because it can increase the lifespan of your computer in the future.
 
+## Thermal Paste
+Thermal paste is a thermally conductive compound which is used as an interface between the CPU and the heatsink itself. Thermal paste trys to eliminate the amount of air gapes or space inbetween the heatsink and CPU in order to maxamize the amount of heat transfer in between the two.
+### Types of Thermal Paste
+Thermal paste comes in differnt varieties which have different amounts of thermal conductivity. From least to greatest thermal conductivity, here are the different types of thermal compound: 
+* Silicon Carbide
+* Zinc Oxide
+* Boron nitride
+* Aluminum nitride
+* Silver
+* Diamond
+
 [Wikipedia - Article on computer cooling](https://en.wikipedia.org/wiki/Computer_cooling)