From e41b8c5585f4e7dce6c68404dc4e5f611cd1e19e Mon Sep 17 00:00:00 2001 From: russkahle Date: Tue, 11 Dec 2018 16:23:17 -0600 Subject: [PATCH] Spelling Fix (#24506) --- guide/english/computer-hardware/cooling/index.md | 2 +- 1 file changed, 1 insertion(+), 1 deletion(-) diff --git a/guide/english/computer-hardware/cooling/index.md b/guide/english/computer-hardware/cooling/index.md index e3f57d0256..8f57d928e0 100644 --- a/guide/english/computer-hardware/cooling/index.md +++ b/guide/english/computer-hardware/cooling/index.md @@ -21,7 +21,7 @@ Cooling devices are available for individual parts on the computer. The two most Room ventilation - Place the computer in a neutral location away from the rooms environmental registers. Keep the computer away from room heaters or vents at all times. * Room placement - Keep the computer away from windows or areas of strong sunlight exposure. Placement in closets can also provide challenges to cooling. It is recommended to keep the computer away from any carpet-like material, which can easily bring dust into the computer. * Placement next to other computers - Locating the computer away from other equipment allows air to flow in and out of the computer. Placement close to other equipment can constrict air flow and increase heat. -* Cable Management - Having a rat's nest of cables can block air flow and make your computer hotter. It is reccomended to take some time to cable manage after building a computer, because it can increase the lifespan of your computer in the future. +* Cable Management = Having a rat's nest of cables can block airflow and make your computer hotter. It is recommended to take some time to cable manage after building a computer, because it can increase the lifespan of your computer in the future. ## Thermal Paste Thermal paste is a thermally conductive compound which is used as an interface between the CPU and the heatsink itself. Thermal paste trys to eliminate the amount of air gapes or space inbetween the heatsink and CPU in order to maxamize the amount of heat transfer in between the two.